liquid silicone for electronic sealing

Category: LIQUID SILICONE FOR ELECTRIONIC SEALANET

thr-1271D adhesive sealant DZ series Silicone material one-component neutral dealcoholization room temperature curing Silicone rubber, after curing metal, plastic, ceramics have good adhesion; It is non-corrosive, has good thermal conductivity, high and low temperature resistance, anti-aging performance, in line with ROHS, REACH environmental requirements, some models through UL94V0 grade. It is widely used in heat transfer of thermal interface materials of LED integrated light source, bonding of power devices on PCBA board and IC radiator, the gap between the heater and the radiator of the electronic and electrical equipment, electronic components is filled and fixed for rapid heat transfer.

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Product Detail

Single component silicone rubber series product description

THR-1271D single component bonded fixed silicone rubber

summarize

This product is a single component, neutral silicone adhesive, belonging to the dealcoholization system, curing under the action of water vapor in the air, after curing into a certain toughness, strength of elastic rubber, high and low temperature resistance, long-term elasticity and stability at -55 ~ 180℃, aging resistance and excellent weather resistance. Wide application surface of bonding, excellent bonding performance for copper, aluminum, PMMA, etc. Due to the release of alcohols in the curing process, there is no corrosion to copper and other materials; No irritating gas release, belong to environmental protection products.

	Project	index
solid the Front	appearance	translucent paste
solid the Front	Extrusion speed（g/3s）	10-30
Surface dry time（min）		2-20
solid the Afte	hardnes（Shore A）	18-23
	Tensile strength（MPa）	≥0.6
	Elongation（%）	≥200
	Tear strength (kN/m)	≥3.5
	Density（25℃）（g/cm³）	1.05±0.05

Property

1cures at room temperature with water vapor in the air dealcoholization curing system

2solidifies into an elastic rubber with certain toughness

Ÿ3has excellent adhesion to most substrates

Ÿ4 has stable performance in the temperature range of -55 ~ 180℃

Application field

Ÿ Used for bonding and sealing of various electronic components

Usage method

1. Clean the surface: clean the surface of the sticky or coated material, remove rust, dust and oil.

2. Sizing: Squeeze the product onto the cleaned surface, make it evenly distributed, and close the adhesive surface to fix it.

3. Solidification: Place the gummed part in air to cure it. The curing process of this product is from the outside to the inside, and the curing depth of 24 hours (25℃, 50% relative humidity) is 2-4mm. If the temperature is low and the humidity is low, the curing time will be extended.

4. Note: After the operation is completed, the unused glue should be tightened immediately, sealed and stored. When used again, if there is a little crust on the seal, it can be removed without affecting normal use.

Packaging and storage

1 Packing: , 300ml/ piece, 2.6L/ piece, 20kg/ barrel or 200kg/ barrel

2 Storage: Keep in a dry, ventilated and cool place

3 Shelf life: 6 months